vibefab

Virtual fabrication runs — plasma-etched, deposited, planarized and rendered from a real level-set + ballistic-transport solver. Click a run to orbit it.

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copper-damascene

0. substrate
1. mask (trench)
2. etch to 0.35µm
3. strip
4. deposit liner 0.03µm
5. deposit copper 0.21µm
6. CMP planarize
siliconlinercopper
dx 20nm14 frames sim 8.78s

deep-via

0. substrate
1. mask (via)
2. etch to 0.8µm
3. wet etch 0.04µm
4. deposit film 0.05µm
5. strip
siliconfilm
dx 20nm14 frames sim 25.7s

gds-layer1

0. substrate
1. mask (gds L1)
2. etch to 0.45µm
3. strip
silicon
dx 25nm7 frames sim 11.09s

l-and-pads

0. substrate
1. mask (3 polygons)
2. etch to 0.5µm
3. deposit film 0.05µm
4. strip
siliconfilm
dx 25nm11 frames sim 14.04s

m1-v1-stack

0. substrate
1. mask (gds L1)
2. etch to 0.25µm
3. strip
4. deposit liner 0.03µm
5. deposit copper 0.16µm
6. CMP planarize
7. deposit oxide 0.2µm
8. mask (gds L2)
9. etch to 0.04µm
10. strip
11. deposit tungsten 0.15µm
12. CMP planarize
siliconlinercopperoxidetungsten
dx 25nm24 frames sim 14.98s

trench-liner

0. substrate
1. mask (trench)
2. etch to 0.7µm
3. deposit film 0.06µm
4. strip
siliconfilm
dx 20nm12 frames sim 21.03s